Our Roadmap Shows the Way... Waytronx
Small Spaces Means Big Trouble
One of the latest trends in computing is the advent of 3D packaging. Stacking several chips in a small space enhances system performance, saves valued real estate and shortens the distance for data and current flow. With all these benefits, it's clear that 3D chipsets are here to stay. The down side for engineers and system developers is that increasing computing power housed in increasingly small spaces means exponential growth in microwarming -- performance reduction and chip overheating.
Waytronx™ 3C for 3D Packaging Roadmap
Waytronx, the leading openly licensable thermal management solutions company, has developed a 3D integrated circuit packaging system, called the Waytronx 3C for 3D Packaging Roadmap. This unique, comprehensive approach to 3D packaging incorporates...
- Cooling
- Communications and
- Current (power)
...into a single integrated system. Unlike the competition, the Waytronx Packaging Roadmap means all the performance attributes are designed in, rather than added on after the silicon design limits have been reached. See the Waytronx 3C for 3D Technology Roadmap at work.
The Roadmap at Work
The Waytronx 3C for 3D Technology Roadmap addresses...
- Microwarming limitations
- Power and signal routing
- Manufacturing yield and system rework
...in a single comprehensive architecture.
Benefits
- Allows semiconductor die to have integrated circuits on both sides of the die for enhanced design options
- Provides more effective transport of cooling, communications and current
- Provides a low risk upgrade path for today’s systems
- As today’s systems transition from 2D packaging to 3D packaging solutions, the same WayCool™ architecture being utilized in today’s high performance systems provides the starting point for 3D packaging, based on the WayCool™ Hybrid Mesh interposer.
For more information about the Waytronx Roadmap and to learn how it can help your products get on the fast (and cool) track, call our development team at (866) WAYTRNX or just drop us a note at engineering@waytronx.com.