Because patent coverage is included in the Waytronx openly licensable business model, our customers benefit from our advanced 3C for 3D technology and packaging roadmap, both today and in the future. Patented and patent-pending embodiments include:

• Fluid-immersed cooling of electronic components
• Spill-proof seals for mounting the device on ICs
• Hermetically sealed coolers
• Embedded coolers within the circuit board
• Hierarchical channel system for spatial and thermal separation of intake and outflow
• Combination of carbon-based heat conductors with micro
  mesh heat exchangers

The WayCool Breakthrough

The proprietary WayCool™ thermal management technology represents a major breakthrough in thermal management capabilities that increases performance and reliability while decreasing energy use in high-end electronic components. WayCool based computing systems have already been shown to break through the 400 Watt barrier of competing solutions.

Patent coverage and associated protections of WayCool related intellectual property provide for the use of meshes for cooling in a broad spectrum of applications.  Unique design elements, including the use of meshes, and resulting functionality underlying the novel WayCool thermal cooling capabilities, have been proven to enable the efficient transfer of heat at extraordinarily high rates, thus promoting superior thermal management in high end electronic components. 

The combination of a directional carbon-based waterblock with a micromesh heat-exchanger for cooling of electronic devices.

To find out more about Waytronx openly licensable architecture and patents, call (866) WAYTRNX or write to engineering@waytronx.com.