Demanding Chips Demand WayCool

Waytronx™ WayCool™ architecture has been designed specifically to address the extreme power density and cooling requirements of advanced CPUs and multicore processors.

WayCool™ Carbon technology conductively removes heat from microprocessors and other advanced devices at rates up to 4x that of typical copper plate heat conductors.  WayCool™ Mesh, WayCoolant™ Liquid coolant, and WayCool™ Pumps and Fans provide a hybrid (liquid + air ) cooling solution of unprecedented thermal capability and convenience. 

Next-generation CPU and graphics processor designs are now incorporating 'MIPs per WATT' design goals in addition to their traditional performance attributes. This shows the increasing industry focus on power consumption and power dissipation in the design of modern processors.

WayCool Mesh offers a roadmap incorporating WayFast™ I/O capabilities as well as a power delivery fabric that will enable future 3D packaging at even higher power densities.

The WayCool U300DT and U400DT Reference Designs for CPUs provide up to 300Watts or 400 Watts of thermal management capacity and replaces liquid or air CPU coolers.

WayCool U300DT and U400DT Reference Designs provide:

• Enhanced performance: Beyond other high performance air-only CPU coolers
• Upgradeability: Supporting current dual core and future quad core CPUs
• Less noise: Quieter than today's air-based coolers
• Compactness: Hybrid liquid-air cooling in a smaller form factor
• Enhanced thermal transfer: Improved results through WayCool Carbon technology in direct contact with WayCool Mesh and the CPU

If you're a processor developer in search of improved MIPs per Watt solutions, call our development team at (866) WAYTRNX or send an email at engineering@waytronx.com.